Power Pcb
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Power Pcb
Printed Circuit Board Manufacturing and Aluminum Based PCBs
Printed Circuit Board Manufacturing is becoming a booming business today with the growing need for smaller electronics packaging and greater functionality. Though earlier the flexible printed circuit was mostly available in polyester or polyimide materials, yet nowadays, the aluminum based are becoming more popular. And the reasons why pcb manufacturers are using these is also because aluminum as a metal itself has many benefits over others.
Electrical and Thermal Conductivity
Printed Circuit Board Manufacturing involves using a base that has excellent heat and electricity conductivity. This makes aluminum a great base to be used in PCBs for dissipation of heat without using additional heat sinks. In fact, for this quality aluminum is the most commonly used material in major power transmission lines everywhere. Again this quality also helps in reducing the effect of thermal stress on all components thus, increasing life and durability. This also helps PCB manufacturers in reducing component operating temperatures, improving reliability. Also called 'metal core printed circuit boards,' aluminum-backed PCBs have improved thermal conduction leading to versatility in component and tracking layout enabling PCB dimensions to be reduced.
Ductility and flexibility
Another great quality of aluminum, which makes it ideal to be used in Printed Circuit Board Manufacturing, is its ductility due to which it can be processed in a number of ways, in its molten condition. And after the product is formed it becomes very durable and safe for long lasting use. Again, though aluminum is lightweight, it strength can be adapted to the application required by modifying the composition of its alloys. This indeed goes a long way in increasing the physical strength of the assembly which is a pre-requisite for flexible printed circuit.
Apart from these, aluminum have many other good qualities which make it ideal for printed circuit board manufacturing, like anti corrosive feature, its reflectivity, non- toxicity, and above all it's recyclable.
About the Author
Jack Hanna a expert author for a variety of Business Equipments related subjects like Barcode Printers, flexible printed circuit, Wireless Mobile Computer, PCB Manufacturers and Flexible Printed Circuit etc.
Power/Ground Inductance in PCBs?
I work in PCB mfg, and a customer uses a particular footprint for a BGA device, and I'd like a layman's explanation of what they are doing. Instead of the standard "dogbone" configuration, where a straight trace connects the via pad to BGA attachment pad, they use dual arced connections (the arch is for better soldermask adhesion) in order to lower inductance for power and ground connections. Can anyone explain this in common terms?
Thanks Contramundi....can you explain at all how this change lowers inductance?
Lowering the inductance on a BGA improves the noise immunity of the device & allows for greater speeds within the device.
Higher inductances does the opposite & manifests itself in noise artifacts such as "ground bounce", and "cross-coupling", and reflective noise".
Signals within the BGA require a good low inductance reference power plane(Power pins) & a reference return (Ground) in order to generate high speed signals without noise artifacts. Any discontinuites in the signals with respect to the reference power & ground planes; such as, any added inductance can turn a text book signal into a signal that is very noisy.
The faster the device, and the more pins the BGA has switching the more important lowering inductance becomes.
In fact, with the high speeds that many parts are capable today would NOT be able to work in older package styles like DIPs and and gull-winged pin devices as the inductance present in the actual pin leads themselves are sufficient to add all kinds of noise artifacts on the signals. Hence, the introduction of BGA which dont' have pin leads and have small traces between BGA pin & die.
This is why the distance between the BGA pin and the PCB card becomes increasingly important as devices get faster and contain hundreds of pins. Even subtle changes in the trace geometry (dog-bone vs straight trace vs arcs) can affect inductance.
I hope this helps
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